Over mould application examples

Call us on:
+44-1525-373800

Applications Gallery

	Suited for packaging of vehicle sensors, Macromelt® low-pressure molding solution is composed of polyamide hot melt and available in various formulations. Material and process solution simultaneously encapsulates sensor's circuitry and forms outer shell of component to enable self-contained, integrated component. Available in amber or black, product is resistant to fluids found in automotive environment.
	Over-mould is a finger grip, strain relief, flex control and anti vibration seal all-in-one. Improves use & reliability and reduces cost.
	Encapsulated sensor is protected from harsh environment and provides strain relief and fixings.
	Multi-connector module has no case. Instead pcb is over-moulded to provide a robust component. The flat surface is printed with logo and data to create the finished product. [Top]
	USB memory stick is given extra appeal by over-moulding an attractive shape and colour. Identity marks are added to the mould.
	The mould incorporates an external cavity, more costly to create with other materials. Strain relief, protection, reliability, aesthetic appeal, shape and cost reduction come together in this component.
	The insulation properties of low pressure polyamide make it suitable for high voltage applications. Sometimes protecting IP is also important: encapsulation can help.
	Mechanical and electrical protection of small wiring assemblies is fast and simple