Just a few examples of where Macromelt has been the solution for applications, Swipe over the images to see them Overmoulded:
Suited for packaging of vehicle sensors, Macromelt® low-pressure molding solution is composed of polyamide hot melt and available in various formulations. Material and process solution simultaneously encapsulates sensor's circuitry and forms outer shell of component to enable self-contained, integrated component. Available in amber or black, product is resistant to fluids found in automotive environment.
Over-mould is a finger grip, strain relief, flex control and anti vibration seal all-in-one. Improves use & reliability and reduces cost.
Encapsulated cable assembly is protected from harsh environment and provides strain relief and fixings.
Multi-connector module has no case. Instead the pcb is over-moulded to provide a robust component. The flat surface is printed with logo and data to create the finished product.
The mould incorporates an external cavity, more costly to create with other materials. Strain relief, protection, reliability, aesthetic appeal, shape and cost reduction come together in this component.
The insulation properties of low pressure polyamide make it suitable for high voltage applications. Sometimes protecting IP is also important: encapsulation can help.
Mechanical and electrical protection of small wiring assemblies is fast and simple