May 2020

Overmoulding versus potting

Low Pressure Overmoulding versus Potting or Encapsulation

In electronics, encapsulation or potting is the process of pouring liquid resin over electrical and electronic components, circuit boards and completed electronic assemblies for electrical insulation and to protect the product against thermal shock, vibration, moisture and corrosive substances. Low Pressure Overmoulding is an injection process where the PCB assembly or electronic part is placed in a specially manufactured aluminium mould tool, and completely surrounded with a liquid compound that effectively forms the housing for the device. We compare the two processes.

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3D printing services

The Three Dimensional World. 3D Printing.

As the technology for 3D printing objects advances, we will see it become a more practical, efficient and cost-effective solution for developing our everyday products. With this advancement, we will begin to see a wider array of materials — including plastics, ceramics and metals — that will completely transform the time spent making products and the manner in which businesses sell those products.

The Three Dimensional World. 3D Printing. Read More »