Moisture can cause a wide range of issues in electronics and other devices, including corrosion of metal components and damage to sensitive electronic components. This is where the Low Pressure Overmoulding process comes to hand, as it can waterproof a wide range of electronic devices including circuit boards and connectors,
Henkel is a world leader in high performance adhesive materials, and Overmould are proud to be their top distributor providing Henkel’s Technomelt polyamide adhesive thermoplastics and LOCTITE® products for over 20 years.
Henkel Technomelt,® used in conjunction with specialist Low Pressure Moulding equipment supplied by Overmould Ltd, offer a superior adhesion and sealing for a wide range of electronics applications enabling fast, low-cost encapsulation in any shape.
A look at the suitability of Low Pressure Overmoulding for parts, PCB’s & connectors with answers to the most common questions about LPM.
Overmould, the leading UK experts in Low Pressure Overmoulding and sensitive electronics encapsulation, have been supporting the wonderful work of their designated charity, International Needs for over 5 years. This organisation has a worldwide reach with its aim to help families suffering through poverty and crisis to create a sustainable future. They work on several …
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Combined Test Solutions is the leading UK provider of test equipment and instruments. We were asked to overmould two of their test products, the first being a Smart-Light, a tool for automated and quick test set up and fixturing of large harness tester interfaces.
Tim Morris of CTS explains the problems experienced before using the Low Pressure Overmoulding process provided by Overmould, how this proved to be the solution and why the chosen overmoulding material was used.
Haldex is a manufacturer of brake products, air suspension systems and products to enhance safety for heavy vehicles. Gabor Novek, Production Planner at Haldex, describes the issues and challenges involved in the recent development of a splitter cable used on the EB+ Gen 3 electronic braking system and how overmoulding proved to be the solution.
Mould sets for low pressure overmoulding are normally manufactured from aluminium and precision-machined to form the features of the desired part. Aluminium is well suited for mould-set manufacturing due to its excellent heat transfer properties (i.e. short cycle times) and is economical from a cost and time perspective.
Aluminium mould-sets are relatively soft and care must be taken not to damage the cavity surface. If the component to be over-moulded has steel or hard glass filled components, it is recommended to have steel inserts in the mould cavity to reduce any wear on key tool components. This is generally required when moulding connectors. Mould-sets can also be manufactured from tool steel such as P-20. It may be required to cross drill steel mould-sets to ensure sufficient cavity cooling.
In electronics, encapsulation or potting is the process of pouring liquid resin over electrical and electronic components, circuit boards and completed electronic assemblies for electrical insulation and to protect the product against thermal shock, vibration, moisture and corrosive substances. Low Pressure Overmoulding is an injection process where the PCB assembly or electronic part is placed in a specially manufactured aluminium mould tool, and completely surrounded with a liquid compound that effectively forms the housing for the device. We compare the two processes.
We are embracing the spirit of giving with our ongoing charitable donations to RUSH Kenya; an organisation that cares for Kenya’s most vulnerable children.
Overmould Ltd has partnered with Henkel Adhesive Technologies to supply adhesive product, technology and expertise to its growing UK customer base.
Henkel delivers leading high-technology adhesive solutions worldwide through technology partners and Overmould, already a long-term partner on the hotmelt moulding technology, are well placed to serve customers.
