Overmould uses the very latest processes and procedures and is expert in precise and efficient low pressure moulding for encapsulating electronics. Our services are specific to each client and each product.


* Low, medium & high volume electronics overmoulding.

* Application evaluation.

* Application engineering and mould tool design.

* Design input for overmoulding circuit boards – ATEX approval etc.

* Mould flow analysis.

* Prototyping and pre-production “3D printed” mould sets.

* Production Aluminium and steel / steel insert tooling mould sets.

* Turnkey solutions and general prototyping.

* Soldering, electronics and general mechanical assembly

* Low Pressure Moulding, Overmoulding, encapsulation & potting services.

* Sealing to IP67 waterproofing standards, and beyond!

* FMEAs and product improvement.

* Testing, both low and high voltage as well as functional.

* Custom packaging (as specified).

Our customers benefit from over 10 years of overmoulding experience and over 40 years of combined knowledge in the business.

If You Need Any Moulding or Product Prototyping Solution

Contact Us