Low Pressure Injection Molding is the process of over-molding electronic devices with Polyamides to protect them. The PCB assembly or electronic part is placed in a specially manufactured aluminium mold tool, and completely surrounded with a liquid compound that effectively forms the housing for the device. It was developed by Henkel and initially introduced to European automotive manufacturing in the 1980’s.
Low Pressure Injection Molding is a faster, cleaner and lower cost alternative to encapsulation. The process is nontoxic, a great advantage when compared to potting with epoxies and or urethanes. Low Pressure Injection Molding is a 3 step process rather than an 8 step process for potting. This removal of process steps reduces manufacturing time, labour and material costs and improves throughput, resulting in increased ROI. There is zero waste, scrap is often recyclable and the process is environmentally friendly, giving off no toxic fumes. The end result is a tamperproof and environmentally sealed product.
Our founder realised early on that there was a strong need in the UK for an alternative to traditional potting processes, typically used to protect and encapsulate electronics. Engineering Solutions Ltd was incorporated in 2003 specialising in Low Pressure Moulding, (LPM) for the UK market. Our equipment is sourced from the USA and Europe and we are Henkel’s UK partner and experts in using their polyamides.
We are proud to be a manufacturing company in the UK committed to a service for companies looking to manufacture product in the UK. We strive to maintain a reputation for excellence, create shorter, more responsive supply chains and offer ease of communication with customers.